Some of Intel’s 12th Gen Alder Lake processors are among the best gaming CPUs you can buy, but certain owners have noticed a seemingly worrisome trend: their LGA 1700 motherboard socket puts so much pressure on the chip that its IHS (integrated heat spreader, the big grey bit on top) starts to bend. This isn’t so much a concern for the CPU’s structural integrity as it is a cooling issue, as a non-flat IHS will struggle to transfer heat to the CPU cooler plate as effectivity.
In a statement to Tom’s Hardware, however, an Intel spokesperson has essentially said it’s not as bad as it sounds. The statement does acknowledge the warping (or “deflection”, to use Intel’s more engineer-y term), but says there’s no evidence thus far to suggest it drives load temperatures up to unsafe levels.
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